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semiconductor packaging refers to the process of processing the tested wafers into individual chips according to the product type and functional requirements. t he encapsulation process is as follows: the wafers from the wafer pre-process are cut into small wafers (die) through the scribing process, and then the cut wafers are glued to the islands of the corresponding lead frames, and then the bond pads of the wafers are connected to the corresponding pins of the lead frames using ultra-fine metal (gold, tin, copper and aluminum) wires or conductive resins, and form the required circuit. after sealing, a series of operations will be carried out, and the finished product will be tested after the sealing is completed.

what are the three major encapsulation for semiconductors?

the three main types of semiconductor packages are metal package, ceramic encapsulation , metal-ceramic encapsulation , and plastic encapsulation according to the materials used.

the first major category: semiconductor metal encapsulation

metal encapsulation started with triode encapsulation , and then slowly applied to inline flat encapsulation , which is basically a metal-glass assembly process. due to the strict size, high precision, metal parts for mass production, so its low price, excellent performance, encapsulation process is easy and flexible, is widely used in transistors and hybrid integrated circuits such as oscillators, amplifiers, frequency converters, a c/dc converters, filters, relays and other products, now and in the future many micro encapsulation and multi-chip modules (mcm) also use this metal encapsulation . the types of metal encapsulation include optic electronics device package with optical window type, with lens type and with optical fiber type; jealousy device package including a type, b type and c type; mixed circuit package including double inline type and flat type; special device package including momentary type, multi-layer multi-window type and non-magnetic material type.

the second major category: semiconductor ceramic encapsulation

in the early days of semiconductor encapsulation , ceramic encapsulation was the mainstay. a long with the development of highly integrated and high-speed semiconductor devices, the miniaturization of electronic devices and the reduction of prices, ceramic encapsulation was partially replaced by plastic encapsulation , but the multiple uses of ceramic encapsulation still have irreplaceable functions, especially the increase in the operating frequency of ntegrated circuit components, the acceleration of signal transmission speed and the increase in chip power consumption, requiring the selection of low resistivity wire conductor material, low dielectric constant, high conductivity insulation material, etc. are required. the types of ceramic packages are dip and sip; for large-scale integrated circuit packages include pga, plcc, qfp and bga.

the third major category: semiconductor plastic encapsulation

plastic encapsulation has a strong vitality due to its low cost, simple process, and suitable for mass production, so it has been developing faster and faster since its birth, and its share in packaging is increasing. currently, plastic encapsulation accounts for more than 95% of the ic market worldwide. the consumer circuit and device market is basically dominated by plastic encapsulation ; the industrial circuit market also accounts for a large proportion and has the largest variety of encapsulation forms. plastic packages include discrete device packages, including type a and type f, and integrated circuit packages, including sop, dip, qfp, and bga.

最先出现在kong tak electronic。

however, the visual processing chip cannot be separated from the acquisition of information and must rely on image sensors. on april 28, dr. wu nanjian, a researcher at the institute of semiconductors, chinese academy of sciences, told the daily economic news that the so-called visual chip is actually an on-chip chip with high-speed image acquisition and real-time image processing functions. t he chip is actually an integrated system chip with high-speed image acquisition and real-time image processing.

he and his team successfully developed a new vision chip and published a paper in 2011 , but up to now no company has realized the integrated chip of “image sensor vision processor”. the company has not yet achieved large-scale mass production of “image sensor vision processor” integrated chip.

this will definitely overturn the existing industry pattern. t he interview with wu was conducted during the first y angtze river delta global science and t echnology innovation project focused roadshow, which was also the first roadshow for the artificial intelligence vision system chip project. how to commercialize the visual system chip? when will it be accepted by the industry? wu nanjian said: “large enterprises do not dare to do to grab the rice bowl, then you can give the startups to do, this is a slow process of transformation.

the following is the daily economic news reporter (hereinafter referred to as nbd) interview with dr. wu nanjian.

nbd: artificial intelligence vision system chip and the existing vision chip what is the difference?

wu nanjian: artificial vision is divided into two parts, similar to the human eye and brain. t he human eye is a typical image sensor, able to take images and some noise removal and other primary image processing; human brain neuron network is a visual image processing system, with a very strong ability to parallel processing of the visual information taken.

at present, domestic and foreign research in the field of artificial vision chip is mainly cmos image sensor chip technology, parallel image processing technology and cmos integration technology.

in the field of cmos image sensor, the current international technology level towards the development of high resolution, wide dynamic range, high frame rate, high intelligence, wide wavelength range and three-dimensional imaging direction. artificial vision system chip can complete image acquisition, and primary (image filtering), intermediate (feature extraction) and advanced (feature identification and irregular processing) three image processing steps.

as the basic research on ai vision technology continues to deepen, the market pattern has developed into a relatively independent and interdependent industrial ecology. in the front end, sony is the image sensor market, production and technology leader,followed by samsung and howe t echnology also maintains a good competitive force; in the back end, mobileye and nvidia (nvidia) is the main provider of visual processing chip manufacturers, the field of domestic companies such as horizon.

the artificial intelligence vision system chip is a high-speed cmos image sensor, parallel signal processing unit and output circuit integrated in a single chip to achieve real-time vision chip system, which is equivalent to a disruptive chip for the existing industry. t he integration of different functional technologies on a single chip has many advantages, simply put the vision system chip has a higher match in terms of processing power, speed, power consumption and cost.

however, regardless of the current start-ups or large enterprises that already have a certain share in the market, they are either doing image sensors or back-end vision processors.

nbd: why have no companies chosen to try to integrate image sensing and processing on the same chip?

in fact, sony is doing this, as you can see in the 201 7 annual report, they have a team doing research on artificial vision systems, but not big. i have also exchanged chip design experience with them, sony is interested in this, but they have concerns, said to do integration may face an immeasurable situation.

not to mention that sony has put a lot of effort in the field of smart phones, only from the image sensor market competition pattern, there are sony, samsung and howie three enterprises, nce the visual chip integration, on the one hand, if the last two united, may shake sony’s position in the whole market; on the other hand, because the back-end (visual processor) enterprises to take away the rice bowl, the industry ecology will have a devastating the impact of the industry ecology. then do the visual processor companies are also the same idea.

but from my personal point of view, will the visual system chip become an inevitable trend? i think it will. like cell phones and cameras combined into a smartphone, the current technology has broken through the low fill rate, low resolution and signal interference serious problems, the scientific research results and put on the market is only a matter of time. the most worrying aspect for large enterprises is that if a completely innovative enterprise does it, there is no such concern.

nbd: if the visual system chip is industrialized in the future, how big is the market space?

wu nanjian: on this point, we have done a projection. 2018, the market size of the image sensor in about 15 billion u.s. dollars, although 12 billion u.s. dollars in the field of smart phones, but the future development of the four faster areas are security, defense, automotive, medical, by 2021 will welcome 4 billion u.s. dollars of market space, the annual growth rate is about 10% to 20%.

visual processor demand growth will be faster, the overall size of the market (including hardware, software, services) in the $ 17 billion to $ 18 billion, from the hardware alone also accounted for about $ 3 billion. if the visual system chip can cover a market size of $ 7 billion, the enterprise in this middle to get 1 % of the market size, its profitability is already very large.

nbd: then, so that ai vision technology really from the laboratory to the application of landing, what are the entry barriers?

wu nanjian: at present, the products based on the technology has been used in some innovative enterprises, such as in the field of industrial products automation inspection can be completely used vision system chip instead of manual inspection; in the field of intelligent monitoring, the past need to install the visual processing chip in the camera with sensor technology, through the data structured, and then compressed to the data center to complete the complex way of data transmission and calculation, and then this structure may be destroyed.

it is important to understand that ics are capital-intensive, technology-intensive, and talent-intensive, so each of the thresholds is very demanding for companies. in terms of technology, after decades of research, at least the more difficult problems are understood at this stage, and the core problems have been overcome in the laboratory because it integrates two kinds of chips: electrical and optical, which only a few teams in china can do.

but want to achieve real commercialization there are still many thresholds, first of all, the problem of capital, has been relying on national projects to support the industrialization is unlikely, so the need to seek the support of social capital; secondly, the issue of talent, the main concern in the early stage of technical research and development of talent preparation, but later more need to join the engineering team and the market team to better enable corporate customers to understand the new vision system chip the advantages and practicality of the new vision system chip.

最先出现在kong tak electronic。

tsmc, umc and mediatek are among the heavyweight semiconductor companies that have held their corporate meetings one after another.

mediatek’s mobile computing platforms and growth products, including smartphones, flat-panel pc chips, internet of t hings, power management chips and asics, are expected to grow by double-digit percentage points in q2, which is the main driver for mediatek’s q2 revenue growth that is no less than the seasonal level in previous years.

with demand for smartphones picking up and demand from umc’s networking and display customers also warming, wafer shipments are expected to increase 6% to 7% qoq in q2 and asps are expected to rise 3%, resulting in estimated q2 revenue growth of 9% to 1 0% qoq.

only mediatek and umc are special cases, t smc pointed out that in the first quarter deferred shipments of wafers to fill the injection, q2 revenue is expected to reach 7.55 billion to 7.65 billion u .s. dollars, a quarterly increase of 7%, if you exclude the impact of deferred shipments, q2 results will only be flat performance compared to the first quarter, economic factors and cell phone seasonal factors still exist.

according to vanguard, customer inventory is slowing down than expected, and the outlook for q2 is conservative, with quarterly revenue of nt$6.4 billion to nt$6.8 billion, down 1 .5% to 7.3% qoq.

it is the general consensus of the industry that the semiconductor industry will bottom out in the first half of this year, and the industry is expecting a significant improvement in the second half of the year. for example, nanya t echnology expects that dram prices will continue to decline in the second quarter, although the rate of decline is expected to be reduced.

memory manufacturer macronix’s chairman, min-chu wu, also said that the price of nor flash will still drop in q2, but if the us-china trade talks reach an agreement in the second half of the year, the nor flash market is expected to improve.

the most difficult t ime for semiconductors has passed

siliconware’s chairman lin wenbo also said recently that the semiconductor boom is “past its worst moment” and that the second half of the year should be better. in addition, the first quarter of this year, the global semiconductor wafer shipments showed a quarterly decrease and annual decrease in the “double-decline” pattern, and down to five quarterly lows, triggering the market inventory adjustment still continues to doubt, the international semiconductor industry association (semi) believes that the first quarter is only a temporary adjustment, the second half of the industry will revive.

in the past, when sis held its conference, its view on the semiconductor boom was regarded as an important weather vane for the industry’s future market. however, after spil was merged into rayson, it no longer holds seminars, and the “iron spokesman on the boom” became extinct. y esterday, after attending the ceremony where mediatek ceo richard t sai was awarded an honorary doctorate by jiaotong university, mr. lin once again expressed his views on the semiconductor market.

mr. lin pointed out that the global economic climate this year is quite unstable, including the international situation, exchange rate fluctuations are very large, coupled with the u .s.-china trade war stalemate between the two sides, and the impact of raw materials also followed the fluctuations, with the general environment becomes weaker, the end consumption power followed by weakening, enterprise investment is also conservative.

he stressed that the overall semiconductor industry is greatly affected by memory fluctuations, as long as dram prices fall by 1 0%, the value of production will fall a lot, but “when everyone looks bad, it should be the bottom of the boom”, and according to the current situation, electronic product orders have gradually warmed up, the situation is slowly getting better, the second half of the overall semiconductor boom should be better.

in addition, sem i yesterday released the latest semiconductor wafer industry analysis report pointed out that the first quarter of this year, the global silicon wafer shipments fell by 5.6% quarterly, down 1 % year-on-year, with a total area of 3.051 billion square inches, down for two consecutive quarters, and down nearly five quarterly lows, triggering market worries about the weakening demand for silicon wafers, is the semiconductor inventory adjustment is not yet over caused.

sem i report said, by the smart phone, servers and other terminal demand is sluggish, and dragged 1 2-inch fab capacity utilization, so that the main application in the logic chip, memory chip 1 2-inch semiconductor silicon wafer spot price is the first to loosen, began to decline, the current price pressure is still not small, only in the power supply, automotive and other related products 8-inch heavily doped silicon wafer demand is more stable.

sem i’s global marketing director and president of t aiwan, william t sao, believes that compared to last year’s all-time high, the global semiconductor wafer shipments are only slightly down at the beginning of this year, mainly due to the seasonal off-season and the industry’s ongoing inventory adjustment. despite this, the industry will pick up in the second half of the year, leading to an uptick in semiconductor wafer shipments.

ms. cyd hsu, chairman of global wafer, the world’s third largest semiconductor wafer fab, said the industry is quite healthy this year. she said that compared to last year’s frenzy of customers lining up for orders, this is not the case this year, but global sources’ production lines are still full, with only some customers making inventory adjustments.

semiconductor industry picks up in the second half of the year?最先出现在kong tak electronic。

the chipset market in 201 8 was a red-hot time. a ccording to research firm ihs markit, in 201 8, the global chipset industry sales of 482 billion u.s. dollars, achieving a 15% growth, while this figure is expected to become 446.2 billion u.s. dollars in 201 9, down 7.4% compared to 201 8. why is there a recession? with the non-net editorial, chipset makers have to take the blame.

let’s look at the first quarter of 201 9 global chip market sales data, according to the world semiconductor trade statistics society (wsts) released a report, the first quarter of 201 9 chip sales of $ 96.8 billion, compared to the same period in 201 8 of $ 111 .1 billion fell 1 3%, compared to the previous quarter of $ 11 4.7 billion is a decline of 1 5.5%.

ic insight statistics are shown in the table below, the decline reached 1 7.6%, which is the fourth largest decline in the market in 35 years.

ic insights believes that intel has an unshirkable responsibility for such a huge drop. intel’s pc processors have been in short supply, and some sources say the situation will continue into the third quarter of this year.

the main reason for the shortage is that intel is focusing on its data center business.

however, intel’s data center business has not been very good this year either. data centers have always been intel’s most expensive and profitable product, and intel’s data center and pc processor business declined across the board in the first quarter, forcing intel to lower its second quarter and annual sales forecasts.

intel said in a statement that first-quarter 2019 revenue was about $15.6 billion and net income was 83 cents per share. analysts’ average estimate was$16.9 billion, or 96 cents per share, according to data compiled by bloomberg. intel said sales for the year will be $69 billion, well below analysts’ forecasts of $71.3 billion.

the data center business of sarensys suffered similarly to intel, with revenue down 7% year-on-year. this is a sign that the data center market is no longer a cash cow for chipset makers this year.

looking ahead to the second half of the year, manufacturers will certainly say that the chipset demand will improve, but when you think about it, this is not the case.

first of all, the demand for data centers is basically close to saturation, and more demand will be shifted to software in the future.

in addition, according to the previously exposed intel cpu roadmap, intel desktop processors in the short term will not use the 10nm process, which has also become a “hand” choke intel’s throat.

first of all, the demand for data centers is basically close to saturation, and more demand will be shifted to software in the future.

the chipset market situation in this year is not optimistic?最先出现在kong tak electronic。

automotive semiconductor revenue to surpass $60 billion by 2022最先出现在kong tak electronic。